even2004： 笔记本电脑散热
About the thermal management of NB, I think the main targets are the processor junction temperature, SO-Dimm thermal specification, HDD, NB and skin temperature...and so on. A thermal module with good performance is very important for CPU, but you have to take care with acoustic issue at the same time. Power management is important, too. The speedstep technology can help us to maintain the processor junction temperature under the specification by throttling. The new DDR2 module seems has more thermal challenge on it, but you can control it from external thermal sensor to lower the bandwidth.... About the thermal issue of HDD, placement is the main problem but a suitable venting can help it obviously. If your product type is T&L, the skin temperature will be a challenge. The different test programs will affect the different zones, an isolate material seems only a little help.... |
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